High-quality processing of various air film holes such as cylindrical holes, square holes, and special-shaped holes, as well as complex curved surface parts with multiple holes. High-efficiency and high-precision processing of large quantities of holes for parts like flow control plates
and grids.
Micron-level inverted cone injection holes for fuel injectors in the automotive industry. High-quality and efficient drilling for flexible ceramics, PCBs, FPCs, sapphire, glass, IC substrates, and other electronic components.
Ultra-Precision Etching of Complex Microstructures: Including filter membranes and other intricate designs.
High-Accuracy Segmented Etching of Resonant Structures on Large Curved Surface Components. Precision Etching of Complex Micro-Grooves in Ceramic Cores.
Ultra-Fine Etching of Hard and Brittle Materials: Such as ceramics and sapphire for the electronics industry.
High-Precision, Non-Ablative Cutting of Complex Patterns for Electronic and Communication Components: Including traveling wave tubes, leads, and other intricate parts.
High-Quality, High-Efficiency Cutting for Electronic Materials: Such as glass, sapphire cover plates, alumina, zirconia, ceramic substrates, silicon wafers, and LED chips.
High-Precision,High-Consistency Cutting for Medical Applications: Including thin-walled tubing such as cardiac stents.
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